SMALL-MOLECULE MATERIALS / FORMULATION INGREDIENTS

Advanced materials & additives

Photoinitiators, reactive monomers and epoxy materials for electronic formulations, alongside organic synthesis intermediates, custom synthesis and tailored formulation additives.

Discuss your application Request TDS / SDS

Material features

Electronic adhesive ingredients
Functional small-molecule materials
Formulation and process compatibility

Selection criteria

01Formulation and intended additive role
02Chemical identity, purity and impurities
03Loading, process and storage conditions

View selection guide

INGREDIENT FAMILIES

Chemistry for your formulation.

Photoinitiators, reactive ingredients and synthesis intermediates.

Photoinitiators

Ingredients for light-curing formulations. Review the source, resin system, loading and cure conditions.

UV470View ingredients

Epoxy reactive ingredients

Reactive diluents and epoxy materials. Review structure, functionality, purity and formulation role.

YW-601 — YW-622View ingredients

Acrylate reactive monomers

Reactive small-molecule formulation ingredients. Confirm substance identity, purity, reactivity and storage conditions.

YW-801 / YW-802 / YW-811View ingredients

Synthesis intermediates

Ingredients for organic synthesis. Distinguish these from adhesive additives and confirm intended use, identity, purity and supply form.

CUSTOM SYNTHESISView ingredients

PRODUCT IDENTITY

Grade, chemistry & CAS records

Identify the ingredient’s role, then match formulation conditions using the exact-grade TDS and SDS.

Reactive ingredient grades and substance identity
Grade	Chemical name	CAS
UV470	Photoinitiator for visible-light-curing formulations	Confirm in grade-specific SDS
YW-601 ↓	Phenyl glycidyl ether	122-60-1
YW-602 ↓	Resorcinol diglycidyl ether	101-90-6
YW-603 ↓	2,6-Diglycidylphenyl glycidyl ether	13561-08-5
YW-612 ↓	Diglycidylphenyl allyl ether	Confirm in grade-specific SDS
YW-614 ↓	Tetrafunctional bisphenol A epoxy resin	Confirm in grade-specific SDS
YW-622 ↓	Phenylene bis(oxirane)	30424-08-9
YW-801 ↓	2-Hydroxy-3-phenoxypropyl methacrylate	Confirm in grade-specific SDS
YW-802 ↓	Hydroquinone bis(2-hydroxy-3-acryloyloxypropyl) ether	Confirm in grade-specific SDS
YW-811 ↓	Glycerol formal acrylate	Confirm in grade-specific SDS

Epoxy reactive ingredients

YW-601

Phenyl glycidyl ether

Monofunctional epoxy reactive diluent

CAS: 122-60-1
Molecular formula: C9H10O2

YW-601 · Phenyl glycidyl ether · structure from the supplied product brochure

Compare formulation viscosity, substrate wetting and the cured joint.

Request this grade’s TDS / SDS

YW-602

Resorcinol diglycidyl ether

Difunctional epoxy reactive ingredient

CAS: 101-90-6
Molecular formula: C12H14O4

YW-602 · Resorcinol diglycidyl ether · structure from the supplied product brochure

Review epoxy equivalent weight, curing-agent balance, loading and cure.

Request this grade’s TDS / SDS

YW-603

2,6-Diglycidylphenyl glycidyl ether

Trifunctional epoxy reactive ingredient

CAS: 13561-08-5
Molecular formula: C15H18O4

YW-603 · 2,6-Diglycidylphenyl glycidyl ether · structure from the supplied product brochure

For encapsulation, laminating and adhesive formulations, review viscosity, cure and interfaces after thermal/humidity exposure.

Request this grade’s TDS / SDS

YW-612

Diglycidylphenyl allyl ether

Epoxy reactive ingredient with an allyl group

CAS: Request the exact-grade SDS.

YW-612 · Diglycidylphenyl allyl ether · structure from the supplied product brochure

Review reactive groups, formulation viscosity and cure process for encapsulation and protective coatings.

Request this grade’s TDS / SDS

YW-614

Tetrafunctional bisphenol A epoxy resin

Multifunctional epoxy base resin

CAS: Request the exact-grade SDS.

YW-614 · Tetrafunctional bisphenol A epoxy resin · structure from the supplied product brochure

Review viscosity and curing stress in structural adhesive, composite and potting formulations.

Request this grade’s TDS / SDS

YW-622

Phenylene bis(oxirane)

Aromatic diepoxy reactive ingredient

CAS: 30424-08-9
Molecular formula: C10H10O2

YW-622 · Phenylene bis(oxirane) · structure from the supplied product brochure

Review isomer composition and cure behaviour for encapsulation, laminates and structural adhesives.

Request this grade’s TDS / SDS

Acrylate & methacrylate ingredients

YW-801

2-Hydroxy-3-phenoxypropyl methacrylate

Hydroxyl-functional methacrylate monomer

CAS: Request the exact-grade SDS.

YW-801 · 2-Hydroxy-3-phenoxypropyl methacrylate · structure from the supplied product brochure

Compare wetting, cure and bonded interfaces in light-curing adhesives, coatings and inks.

Request this grade’s TDS / SDS

YW-802

Hydroquinone bis(2-hydroxy-3-acryloyloxypropyl) ether

Difunctional acrylate reactive ingredient

CAS: Request the exact-grade SDS.

Review double bonds, hydroxyl groups, viscosity, loading and cure in light-curing formulations.

Request this grade’s TDS / SDS

YW-811

Glycerol formal acrylate

Acrylate diluent for light-curing formulations

CAS: Request the exact-grade SDS.

YW-811 · Glycerol formal acrylate · structure from the supplied product brochure

Review cyclic-structure composition, viscosity and cure conditions for adhesives, inks and 3D-printing formulations.

Request this grade’s TDS / SDS

Featured resin and bonding grades

Keep the supplied grade suffix and confirm composition and specifications in its own TDS and SDS.

Grade	Material type	Documents
YW-603E	Epoxy resin	Request TDS / SDS
YW-614E	Epoxy resin	Request TDS / SDS
YW-613E	Epoxy bonding material	Request TDS / SDS

Composition & structure notes

YW-622 — The brochure illustrates para/meta structures. This CAS does not establish one pure positional isomer; confirm the composition in the exact-grade SDS.

YW-802 — Confirm the named isomer and structural identity in the current grade-specific SDS.

APPLICATION & SELECTION

From chemistry to performance.

Initiating light cure

Review the photoinitiator against the light source and reactive resin.

Evaluation focus: Wavelength, exposure, loading, film thickness, colour and cure.

Epoxy viscosity & reactivity

Compare reactive diluents and multifunctional ingredients in the resin/curing-agent system.

Evaluation focus: Functionality, equivalent weight, purity, formulation viscosity and cure.

Light-cured films & bonded interfaces

Review acrylate ingredients against application process and film/joint requirements.

Evaluation focus: Reactive groups, viscosity, loading, adhesion, cure and storage.

Electronic adhesive application · edited display-module dispensing illustration

PROCESS ENGINEERING

Formulation and cure testing

Share formulation needs
Check ingredient records
Compare addition methods
Check cure & storage

TECHNICAL REVIEW

Ingredient compatibility

For numerical specifications, refer to the current grade-specific TDS.

Chemical identity: Confirm chemical name, CAS and composition category by grade.
Purity and impurities: Specify required analytical fields and methods.
Loading and compatibility: Compare loading, temperature, sequence and changes over time.
Storage and handling: Confirm conditions against current SDS and ingredient specifications.

Frequently asked questions

How does this differ from a finished electronic adhesive?

This page concerns ingredients for formulation design. Use Electronic adhesives for finished adhesive selection and this category for formulation-function reviews.

Related materials and ingredients

Electronic adhesives Conformal coatings Functional materials Fluorinated fluids

CUSTOM SYNTHESIS & ADDITIVES

Custom synthesis & additives

Share the target structure, intended role, purity, quantity and evaluation conditions. Discuss the synthesis route, supply format and compatibility with your formulation.

Discuss custom synthesis or additives

DOCUMENTS & SAMPLES