Repeatable dispensing
Match temperature, dose, needle and dispensing path.
- Record
- Applied width, dose, flow and assembly time
← Industry & component applications
BOARDS / DISPLAYS / PRECISION JOINTS
Electronics & semiconductor
Organize bonding, sealing, thermal transfer and board protection around process and reliability needs.
BONDING & PROTECTION
Start with the component.
EXPLORE THE COMPONENT
Explore where the material works.
01Display modules and joints＋
CONDITIONS TO REVIEW
Substrates, joint area, gap and cure method
See the test methods ↓Explore the component challenge02Boards and electronic parts＋
CONDITIONS TO REVIEW
Coverage, film thickness, masking and inspection
See the test methods ↓Explore the component challenge03Precision dispensing process＋
CONDITIONS TO REVIEW
Dose, equipment, cure conditions and assembly cycle
See the test methods ↓Explore the component challengeOPERATING CONDITIONS
Operating conditions & tests
Compare before and after material changes under matching conditions.
Cure and substrate effects
Match cure-process conditions to component limitations.
- Record
- Cure state, temperature history and joint appearance
Temperature & interfaces
Check joint strength and appearance after exposure on actual geometry.
- Record
- Before/after values, failure location and interface condition
APPLICATION TESTING
Component test sequence
- Review the component
- Set test criteria
- Compare materials
- Verify the assembly
TEST BRIEF
Information for your enquiry
- Component and materials
- Material grades, preparation, dimensions, contact surfaces and assembly conditions.
- Environment and operation
- Substrates and gap / Cure and dispensing conditions / Heat, moisture and insulation
- Process and current material
- Current grade, application/cure/cleaning conditions and when behaviour changed.
- Acceptance and records
- Targets, measurement methods, before/after photographs and values, and required life conditions.
DOCUMENTS & SAMPLES
Documents & evaluation samples
Request the information you need for product selection and internal evaluation.
Discuss these requirements