01
PUR hot-melt adhesives
Review heated dispensing and moisture cure, including substrates, dispensing temperature, assembly time and storage.
Enquire about this seriesBONDING / SEALING / FIXING
Electronic adhesives
Materials for bonding, fixing and sealing electronic parts, with UV, heat and moisture cure options to review.
BONDING & PROTECTION
Start with the component.
Material features
- UV, heat and moisture cure
- Precision dispensing
- Bonding and sealing
Selection criteria
- 01Substrates and surface preparation
- 02Cure equipment and takt time
- 03Strength, flexibility and durability
PRODUCT SERIES
Product series by application
Adhesive chemistry & cure
Mixing format
Assembly & evaluation role
Choose the chemistry and cure process. Dual-cure combinations are confirmed for each grade.
02
UV and dual-cure adhesives
Review illuminated and shadowed regions, then align the grade-specific thermal or moisture cure process.
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03
Epoxy and SMT adhesives
Review electronic fixing and encapsulation against actual parts, dot geometry, cure and downstream processes.
Enquire about this seriesMore series (6)
04
Modified acrylic adhesives
Assembly-bonding candidates to review by substrates, gap, working time and joint requirements.
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05
Silicone adhesives & seals
Review electronic bonding and sealing by mixing, cure, joint geometry and effects on nearby materials.
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06
UV adhesives for PCBA fixing
UV-curing adhesives for fast positioning and fixing of components on PCBA. Review dispensing locations, UV access, cure conditions and adhesion to the actual materials.
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07
Two-part adhesives
Review bonding or sealing by mixing ratio, bead geometry, cure, thermal and mechanical conditions.
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08
Thermal silicone adhesives
Thermal silicone adhesives for heat transfer and bonding. Review the exact grade, bond thickness and cure conditions.
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09
Two-part epoxy adhesives
Mix resin and hardener before use. Review candidates such as EP8210 by substrates, mixing, working time and cure.
Enquire about this seriesPRODUCT LINEUP
Product lineup
Verified PUR, SMT, thermal silicone and two-component epoxy adhesive names. These do not define the performance of an entire series; confirm grade-specific process compatibility in current records.
Featured adhesive grades
| Grade / product | Material type | Applications to review |
|---|---|---|
| SR-2122Enquire | 2K thermal silicone adhesive | Electronic thermal-management and bonding interfaces |
| EP8210Enquire | Two-component epoxy adhesive | Structural bonding of parts |
| UR 6140Enquire | Moisture-cure PUR hotmelt | Assembly bonding and heated dispensing |
| EP8211Enquire | Heat-curing 1K epoxy SMT adhesive | Electronic-component fixing on PCBs |
Quote the grade or product name in your enquiry. Composition, numerical properties and use conditions are provided in current product-specific TDS and SDS.
APPLICATION & SELECTION
Explore the parts and processes.
Application examples for evaluation on actual parts. Match operating conditions with the exact-grade documentation.
01
PCB & connector bonding
Review component fixing and connector bonding on PCBs around the joint area, dispensing path and cure conditions.
- Evaluation focus
- Dose, unwanted flow, shadowed areas, cure verification and joints after exposure.
02
Display & glass modules
Review display and glass bonding against optical-path, appearance and cure requirements.
- Evaluation focus
- Transmission, bubbles, cure, displacement and surrounding flow.
03
Electronic encapsulation & fixing
Define the encapsulation area, chemistry and cure process for the electronic module.
- Evaluation focus
- Gap, filling, viscosity, cure temperature, shrinkage and interfaces.
More evaluation examples (3)
04
Housing & structural joints
Review substrates, joint geometry, gaps and flexibility for housing and structural bonds.
- Evaluation focus
- Preparation, joint area, load, failure location and durability.
05
Two-part mixing & filling
Match the cartridge and mixer to the dispensing process; confirm mixing ratio and working time for the grade.
- Evaluation focus
- Mixing ratio, uniformity, working time, bubbles and fill geometry.
06
Thermal interfaces & flexible joints
Define thermal, bonding and sealing roles together with required electrical properties.
- Evaluation focus
- Thickness, contact area, stress, electrical insulation and thermal cycling.
PROCESS ENGINEERING
Dispensing, assembly and cure
- Review substrates
- Set dispensing & assembly
- Verify cure conditions
- Check joint reliability
TECHNICAL REVIEW
Joint performance and process
For numerical specifications, refer to the current grade-specific TDS.
- Viscosity and dispensing
- Specify temperature, dose and applied geometry.
- Cure conditions
- Confirm the grade-specific light, heat or moisture cure mechanism.
- Bond strength
- Match substrates, test method and conditioning.
- Post-cure stress
- Review joint geometry and changes after thermal cycling.
Frequently asked questions
Will a UV material cure in shadowed areas?
This depends on the exposure path and grade-specific cure mechanism. Check shadowed areas and depth, then define the required process.
DOCUMENTS & SAMPLES
Documents & evaluation samples
Request the information you need for product selection and internal evaluation.
Explore application requirements
Automotive applications
Explore automotive lubrication alongside bonding, sealing and electronic protection by component.
Electronics & semiconductor
Organize bonding, sealing, thermal transfer and board protection around process and reliability needs.
Precision & optical
Evaluate materials for micro torque, cleanliness, low migration and controlled feel.